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Publication

On-going stuffs

  1. ‘‘MigSpike: A Migration Based Algorithm and Architecture for Scalable Robust Neuromorphic Systems’’ (under major revision).

  2. ‘‘Towards Robust Cognitive 3D Brain-inspired Cross-paradigm System’’ (under major revision).

  3. ‘‘A Low-Power, High-Accuracy with Fully On-Chip Ternary Weight Hardware Architecture for Deep Spiking Neural Networks’’ (under review).

Book chapters

  1. Xuan-Tu Tran, Khanh N. Dang, and Alain Merigot, ‘‘Low Cost Inter-prediction Architecture in H.264/AVC Encoders with an Efficient Data Reuse Strategy’’, Advances in Engineering Research. Volume 40, Chapter 6. Nova Science Publishers, 2020. ISBN 978-1-53618-929-2. [LINK].

  2. Khanh N. Dang and Abderazek Ben Abdallah, ‘‘Architecture and Design Methodology for Highly-Reliable TSV-NoC Systems’’, Invited Book Chapter, Horizons in Computer Science Research. Volume 16, Chapter 7. Nova Science Publishers, 2018. ISBN: 978-1-53613-327-1. [LINK]/[PDF].

International journal papers

  1. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran, ‘‘HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems’’, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, (in press). [DOI]/[PDF].

  2. Mark Ogbodo, Khanh N. Dang, Abderazek Ben Abdallah, ‘‘On the Design of a Fault-tolerant Scalable Three Dimensional NoC-based Digital Neuromorphic System with On-chip Learning’’, IEEE Access, IEEE, Volume 9, pp 64331 - 64345, 2021. [DOI]/[PDF].

  3. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran, ‘‘A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems’’, IEEE Access, IEEE, Volume 8, pp 166642-166657, 2020. [DOI]/[PDF].

  4. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, ‘‘TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems’’, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE, Volume 28, Issue 3, pp 672 - 685, 2020. [DOI]/[PDF].

  5. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, ‘‘A non-blocking non-degrading multi-defect link test method for 3D-Networks-on-Chip’’, IEEE Access, IEEE, Volume 8, pp 59571 - 59589, 2020. [DOI]/[PDF].

  6. Khanh N. Dang, Akram Ben Ahmed, Yuichi Okuyama, Abderazek Ben Abdallah, ‘‘Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems’’, IEEE Transactions on Emerging Topics in Computing (TETC), IEEE, Volume 8, Issue 3, pp 577-590, 2020. [DOI]/[PDF].

  7. Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah, ‘‘A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model’’, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE, Volume 25, Issue 11, pp 3099-3112, 2017. [DOI]/[PDF].

  8. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, ‘‘A Low-overhead Soft-Hard Fault Tolerant Architecture, Design and Management Scheme for Reliable High-performance Many-core 3D-NoC Systems’’, Journal of Supercomputing (SUPE), Springer, Volume 73, Issue 6, pp 2705–2729, 2017. [DOI]/[PDF].

Domestic journal papers

  1. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, ‘‘Thermal distribution and reliability prediction for 3D Networks-on-Chip’’, VNU Journal of Computer Science and Communication Engineering, VNU, Volume 36, No 1, pp 65-77, 2020. [DOI/PDF].

  2. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, ‘‘2D Parity Product Code for TSV online fault correction and detection’’, REV Journal on Electronics and Communications (JEC), REV, pp. 11-21, Vol. 8, No. 1-2, Jan. - Jun., 2020. [DOI/PDF].

  3. Khanh N. Dang and Xuan-Tu Tran, ‘‘An adaptive and high coding rate soft error correction method in Network-on-Chips’’, VNU Journal of Computer Science and Communication Engineering, VNU, Volume 35, No 1, pp 32-45, 2019. [DOI/PDF].

  4. Ngoc-Mai Nguyen, Edith Beigne, Duy-Hieu Bui, Nam-Khanh Dang, Suzanne Lesecq, Pascal Vivet, Xuan-Tu Tran, ‘‘An Overview of H.264 Hardware Encoder Architectures including Low-Power Features’’, REV Journal on Electronics and Communications (JEC), REV, pp. 8-17, Vol. 4, No. 1-2, Jan. - Jun., 2014. [DOI/PDF].

Refereed conference papers

  1. Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah, ‘‘Three Dimensional NoC-Based Neuromorphic System With On-Chip Learning’’, The International Symposium on Ubiquitous Networking (UNet’21), 20211 (accepted).

  2. Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, and Francesca Iacopi, ‘‘A lightweight Max-Pooling method and architecture for Deep Spiking Convolutional Neural Networks’’, 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Dec. 8-10, 2020.

  3. Khanh N. Dang, Akram Ben Ahmed, Fakhrul Zaman Rokhani, Abderazek Ben Abdallah, and Xuan-Tu Tran, ‘‘A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs’’, 2020 International Conference On Advanced Technologies For Communications (ATC), Nov. 8-10, 2020.

  4. Ogbodo Mark Ikechukwu, Khanh N. Dang, Tomohide Fukuchi, Abderazek Ben Abdallah, ‘‘Architecture and Design of a Spiking Neuron Processor Core Towards the Design of a Large-scale Event-Driven 3D-NoC-based Neuromorphic Processor’’, The ACM Chapter International Conference on Educational Technology, Language and Technical Communication (ETLTC), Jan. 27-31, 2020.

  5. Mark Ogbodo, The Vu, Khanh N. Dang and Abderazek Abdallah, ‘‘Light-weight Spiking Neuron Processing Core for Large-scale 3D-NoC based Spiking Neural Network Processing Systems’’, 2020 IEEE International Conference on Big Data and Smart Computing (BigComp), Feb. 19-22, 2020.

  6. Khanh N. Dang and Abderazek Ben Abdallah ‘‘An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems’’, 2019 International Conference on Internet of Things, Embedded Systems and Communications (IINTEC), Dec. 20-22, 2019.

  7. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, ‘‘2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults’’, 2019 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Nov. 11-14, 2019.

  8. Khanh N. Dang, Akram Ben Ahmed, and Xuan-Tu Tran, ‘‘ An on-communication multiple-TSV defects detection and localization for real-time 3D-ICs’’, 2019 IEEE 13th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), Oct. 1-4, 2019.

  9. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, ‘‘TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects’’, The IEEE Symposium on VLSI (ISVLSI) 2019, Jul. 15-17, 2019.

  10. Khanh N. Dang and Xuan-Tu Tran, ‘‘Parity-based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication’’, 2018 IEEE 12th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), Sep. 12-14, 2018.

  11. Abderazek Ben Abdallah, Khanh N. Dang, Yuichi Okuyama, ‘‘A Low-overhead Fault tolerant Technique for TSV-based Interconnects in 3D-IC Systems’’, The 18th International conference on Sciences and Techniques of Automatic control and computer engineering (STA), Dec. 21-23, 2017.

  12. Shunsuke Mie, Yuichi Okuyama, Yusuke Sato, Ye Chan, Nam Khanh Dang, Ben Abdellash Abderazek, ‘‘Real-Time UAV Attitude Heading Reference System Using Extended Kalman Filter for Programmable SoC’’, 2017 IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), Sep. 18-20, 2017.

  13. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, ‘‘Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D NoC System’’, 25th IEEE Asian Test Symposium (ATS), Nov. 21-24, 2016,

  14. Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah, ‘‘Soft-Error Resilient Network-on-Chip for Safety-Critical Applications’’, 2016 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT), Jun. 27 – 29, 2016.

  15. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, Xuan-Tu Tran, ‘‘Soft-Error Resilient 3D Network-on-Chip Router’’, IEEE 7th International Conference on Awareness Science and Technology (iCAST), Sep. 22-24, 2015,

  16. Ngoc-Mai Nguyen, Edith Beigne, Suzanne Lesecq, Duy-Hieu Bui, Nam-Khanh Dang, Xuan-Tu Tran, ‘‘H.264/AVC Hardware Encoders and Low-Power Features’’, 2014 IEEE Asia Pacific Conference on Circuits & Systems (APCCAS), Nov. 17-20, 2014.

  17. Nam-Khanh Dang, Xuan-Tu Tran, Alain Merigot, ‘‘An Efficient Hardware Architecture for Inter-Prediction in H.264/AVC Encoders’’, 17th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS), Apr. 23-25, 2014.

  18. Hai-Phong Phan, Hung K. Nguyen, Duy-Hieu Bui, Nam-Khanh Dang, Xuan-Tu Tran, ‘‘ System-on-Chip Testbed for Validating the Hardware Design of H.264/AVC Encoder’’, National Conference on Electronics and Communications (REV2013-KC01), Hanoi, Dec., 2013.

  19. Nam Khanh Dang, Van-Mien Nguyen, Xuan Tu Tran, ‘‘A VLSI Implementation for Inter-Prediction Module in H.264/AVC Encoders’’, 2013 International Conference on Integrated Circuits and Devices in Vietnam (ICDV), 2013,

  20. Nam Khanh Dang, Thanh Vu Le Van, Xuan Tu Tran, ‘‘FPGA implementation of a low latency and high throughput network-on-chip router architecture’’, 2011 International Conference on Integrated Circuits and Devices in Vietnam (ICDV), 2011.

Invited talks

  1. Khanh N. Dang,‘‘Fault-Tolerance Through-Silicon-Via For 3-D Integrated Circuits’’ Advanced Institute of Engineering and Technology, VNU-UET, VNU, Vietnam, 2021.

  2. Khanh N. Dang, ‘‘TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems’’, The 3nd IEEE South-East Asia Workshop on Circuits and Systems (SEACAS), UPM, Malaysia, 2019. [SLIDE].

  3. Khanh N. Dang, ‘‘Toward Real-time Fault-tolerance Through-Silicon-Via based 3D Network-on-Chips’’, The 2nd IEEE South-East Asia Workshop on Circuits and Systems (SEACAS), Bandung, Indonesia, 2018. [SLIDE].

  4. Khanh N. Dang, ‘‘Fault-Tolerant Architectures and Algorithms for 3D-Network-on-Chips’’, The 1st IEEE South-East Asia Workshop on Circuits and Systems (SEACAS), Hanoi, Vietnam, 2017. [SLIDE].

Thesis

  1. Dang Nam Khanh, ”Development of On-Chip Communication Fault-Resilient Adaptive Architectures and Algorithms for 3D-IC Technologies (3次元IC技術のための適応型耐障害チップ内通信アーキテクチャとアルゴリズムの開発)’’, Research advisor: Prof. Abderazek Ben Abdallah. [DOI]. [PDF]. [SLIDE].