Patent

Filed patents

1. A. Ben Abdallah, Huakun Huang, Khanh N. Dang, Jiangning Song, ‘‘ＡＩプロセッサ (AI Processor)’’, 特願2020-194733, Japan patent, (patent filed)

2. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, ‘‘Distance-aware Extended Parity Product Coding for multiple faults detection for on-chip links’’,特願2020-171553, Japan patent, (patent filed)

3. A. Ben Abdallah, Khanh N. Dang, ‘‘A three-dimensional system on chip in which a TSV group including a plurality of TSVs provided to connect between layers’’, 特願2020-094220, Japan patent, (patent filed)

4. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, ‘‘A TSV fault-tolerant router system for 3D-Networks-on-Chip’’, 特願 2017-218953, JP2019092020A, Japan (patent pending) [URL].