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Research

Thermal-aware 3D interconnect design

Funded by NAFOSTED under No. 102.01-2018.312 (2019-2011). I am the main PI of the project. We target to develop algorithms and architectures to solve the on-line defect on 3D-interconnect with awareness of thermal impact.


Caption: Normalized thermal acceleration for lifetime reliability of TSV (Cooper) with academics (RAMP, Black, and Arrherius), industry (HDR4) and military (MIL-HDBK-217F) model. The fault rates are normalized to 343.15K (70C).
Selected publications:

  1. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran, ‘‘A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems’’, IEEE Access (in press)

  2. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems”, IEEE Transactions on Very Large Scale Integration Systems (TVLSI) (IF= 1.946), IEEE, Volume 28, Issue 3, pp 672 - 685, 2020. [DOI], [PDF]

  3. Khanh N. Dang , Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “A non-blocking non-degrading multi-defect link test method for 3D-Networks-on-Chip”, IEEE Access, (IF=4.098), 2020 (in press). [DOI], [PDF].

  4. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, ‘‘Thermal distribution and reliability prediction for 3D Networks-on-Chip’’, VNU Journal of Computer Science and Communication Engineering, VNU, Volume 36, No 1, pp 65-77, 2020. [DOI/PDF]

  5. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “2D Parity Product Code for TSV online fault correction and detection”, REV Journal on Electronics and Communications (JEC), REV-JEC, (accepted, editing)

  6. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults”, 2019 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Nov. 11-14, 2019 (accepted).

  7. Khanh N. Dang, Akram Ben Ahmed, and Xuan-Tu Tran, _“ An on-communication multiple-TSV defects detection and localization for real-time 3D-ICs”, 2019 IEEE 13th International Symposium on Embedded MulticoreMany-core Systems-on-Chip (MCSoC), Oct. 1-4, 2019 (in press).

  8. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects”, The IEEE Symposium on VLSI (ISVLSI) 2019, Jul. 15-17, 2019 (in press).


Technical Reports:

  1. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “Report on power, thermal and reliability prediction for 3D Networks-on-Chip”, arXiv preprint arXiv:2003.08648.


Patents:

  1. A. Ben Abdallah, Khanh N. Dang, ‘‘Non-blocking Multiple-TSV Defects Localization for three Dimension Integrated Circuits (3D-ICs)’’, Japan patent, (under internal screening)

  2. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, ‘‘Distance-aware Extended Parity Product Coding for multiple faults detection for on-chip links’’, Japan patent, (under review)


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