News

2021-03: Our paper titled “HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems” is accepted for publication in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. [PDF].

2020-11: I have started working for University of Aizu as a visiting scientist.

2020-11: Our new patent application named “An AI processor” has been filed.

2020-11: Our paper titled “A lightweight Max-Pooling method and architecture for Deep Spiking Convolutional Neural Networks” has been accepted for APCCAS 2020.

2020-09: Our paper tilted “A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems” has been accepted for IEEE Access. Access the paper here.

2020-08: Our paper tilted “Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems” has been published for IEEE Transactions on Emerging Topics in Computing (TETC). Access the paper here.

2020-07: Due to the Covid-19 epidemic, MCSoC 2020 is postponed to 2021 in the same venue.

2020-04: Our paper titled “TSV-OCT: A scalable online multiple TSV defects localization for 3D-ICs” is published for IEEE Trans. on VLSI systems! [Preprint].

2020-03: Our journal paper titled “A non-blocking non-degrading multi-defect link test method for 3D-Networks-on-Chip” has been accepted for IEEE Access. [Preprint].

2019-12: I will be a visiting researcher at The University of Aizu in 2020 to continue the work on designing Spiking Neural Network on hardware.

2019-04: We visit Prof. Pham's Laboratory at UC Davis as a part of our WorldBank funded project.

2018-12: Our project has been funded by NAFOSTED under No. 102.01-2018.312 (2019 - 2011).

2018-09: Our project has been funded by VNU-UET under No. CN 19.10 (2018 - 2019).