Publications


Disclaimer: This page contains PDF files of articles that might be covered by copyright. Please do not retrieve, copy, or distribute these files as it may violate copyright protection laws.

Under preparation

  • “MigSpike: A Migration Based Algorithm and Architecture for Scalable Robust Neuromorphic Systems”,
  • “A Low-Power, High-Accuracy with Fully On-Chip Ternary Weight Hardware Architecture for Deep Spiking Neural Networks”,
  • “Neuromorphic Computing Principles and Organization”,

Patents

  1. A. Ben Abdallah, Huakun Huang, Khanh N. Dang, Jiangning Song, “AIプロセッサ (AI Processor)”, 特願2020-194733, Japan patent, (patent filed).
  2. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, “Distance-aware Extended Parity Product Coding for multiple faults detection for on-chip links”, 特願2020-171553, Japan patent, (patent filed).
  3. A. Ben Abdallah, Khanh N. Dang, “A three-dimensional system on chip in which a TSV group including a plurality of TSVs provided to connect between layers”, 特願2020-094220, Japan patent, (patent filed)
  4. A. Ben Abdallah, Khanh N. Dang, Masayuki Hisada, “A TSV fault-tolerant router system for 3D-Networks-on-Chip”, 特願 2017-218953, JP2019092020A, Japan (patent pending) [LINK].

Book chapters

  1. Xuan-Tu Tran, Khanh N. Dang, and Alain Merigot, “Low Cost Inter-prediction Architecture in H.264/AVC Encoders with an Efficient Data Reuse Strategy”, Advances in Engineering Research. Volume 40, Chapter 6. Nova Science Publishers, 2020. ISBN 978-1-53618-929-2. [LINK].
  2. Khanh N. Dang and Abderazek Ben Abdallah, “Architecture and Design Methodology for Highly-Reliable TSV-NoC Systems”, Invited Book Chapter, Horizons in Computer Science Research. Volume 16, Chapter 7. Nova Science Publishers, 2018. ISBN: 978-1-53613-327-1. [LINK]/[PDF].

Journal papers

  1. Abderazek Ben Abdallah, Khanh N. Dang, “Towards Robust Cognitive 3D Brain-inspired Cross-paradigm System”, Frontiers in Neuroscience, Frontiers, Volume 15, pp. 795, 2021. [DOI: 10.3389/fnins.2021.690208]/[PDF].
  2. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran, “HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, in press [DOI: 10.1109/TCAD.2021.3069370]/[PDF].
  3. Mark Ogbodo, Khanh N. Dang, Abderazek Ben Abdallah, “On the Design of a Fault-tolerant Scalable Three Dimensional NoC-based Digital Neuromorphic System with On-chip Learning”, IEEE Access, IEEE, Volume 9, pp. 64331 - 64345, 2021. [DOI: 10.1109/ACCESS.2021.3071089]/[PDF].
  4. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran, “A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems”, IEEE Access, IEEE, Volume 8, pp. 166642-166657, 2020. [DOI: 10.1109/ACCESS.2020.3022904]/[PDF].
  5. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems”, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE, Volume 28, Issue 3, pp. 672 - 685, 2020. [DOI: 10.1109/TVLSI.2019.2948878]/[PDF].
  6. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “A non-blocking non-degrading multi-defect link test method for 3D-Networks-on-Chip”, IEEE Access, IEEE, Volume 8, pp. 59571 - 59589, 2020. [DOI: 10.1109/ACCESS.2020.2982836]/[PDF].
  7. Khanh N. Dang, Akram Ben Ahmed, Yuichi Okuyama, Abderazek Ben Abdallah, “Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems”, IEEE Transactions on Emerging Topics in Computing (TETC), IEEE, Volume 8, Issue 3, pp. 577-590, 2020. [DOI: 10.1109/TETC.2017.2762407]/[PDF].
  8. Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah, “A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model”, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), IEEE, Volume 25, Issue 11, pp. 3099-3112, 2017. [DOI: 10.1109/TVLSI.2017.2736004]/[PDF].
  9. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, “A Low-overhead Soft-Hard Fault Tolerant Architecture, Design and Management Scheme for Reliable High-performance Many-core 3D-NoC Systems”, Journal of Supercomputing (SUPE), Springer, Volume 73, Issue 6, pp. 2705–2729, 2017. [DOI: 10.1007/s11227-016-1951-0]/[PDF].

VN journal papers

  1. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “Thermal distribution and reliability prediction for 3D Networks-on-Chip”, VNU Journal of Computer Science and Communication Engineering, VNU, Volume 36, No 1, pp. 65-77, 2020. [DOI:10.25073/2588-1086/vnucsce.245].
  2. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “2D Parity Product Code for TSV online fault correction and detection”, REV Journal on Electronics and Communications (JEC), REV, pp. 11-21, Vol. 8, No. 1-2, Jan. - Jun., 2020. [DOI: 10.21553/rev-jec.242].
  3. Khanh N. Dang and Xuan-Tu Tran, “An adaptive and high coding rate soft error correction method in Network-on-Chips”, VNU Journal of Computer Science and Communication Engineering, VNU, Volume 35, No 1, pp. 32-45, 2019. [DOI: 10.25073/2588-1086/vnucsce.218].
  4. Ngoc-Mai Nguyen, Edith Beigne, Duy-Hieu Bui, Nam-Khanh Dang, Suzanne Lesecq, Pascal Vivet, Xuan-Tu Tran, “An Overview of H.264 Hardware Encoder Architectures including Low-Power Features”, REV Journal on Electronics and Communications (JEC), REV, pp. 8-17, Vol. 4, No. 1-2, Jan. - Jun., 2014. [DOI:10.21553/rev-jec.72].

Conference papers

  1. Ogbodo Mark Ikechukwu, Khanh N. Dang and Abderazek Ben. Abdallah, “Energy-efficient Spike-based Scalable Architecture for Next-generation Cognitive AI Computing Systems” Springer Lecture Note in Computer Science (LNCS), International Symposium on Ubiquitous Networking 2021 (UNET21), May 19 – May 22, 2021, Marakesh, Morocco. Best Student Paper Award
  2. Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, and Francesca Iacopi, “A lightweight Max-Pooling method and architecture for Deep Spiking Convolutional Neural Networks”, 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Dec. 8-10, 2020.
  3. Khanh N. Dang, Akram Ben Ahmed, Fakhrul Zaman Rokhani, Abderazek Ben Abdallah, and Xuan-Tu Tran, “A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs”, 2020 International Conference On Advanced Technologies For Communications (ATC), Nov. 8-10, 2020.
  4. Ogbodo Mark Ikechukwu, Khanh N. Dang, Tomohide Fukuchi, Abderazek Ben Abdallah, “Architecture and Design of a Spiking Neuron Processor Core Towards the Design of a Large-scale Event-Driven 3D-NoC-based Neuromorphic Processor”, The ACM Chapter International Conference on Educational Technology, Language and Technical Communication (ETLTC), Jan. 27-31, 2020.
  5. Mark Ogbodo, The Vu, Khanh N. Dang and Abderazek Abdallah, “Light-weight Spiking Neuron Processing Core for Large-scale 3D-NoC based Spiking Neural Network Processing Systems”, 2020 IEEE International Conference on Big Data and Smart Computing (BigComp), Feb. 19-22, 2020.
  6. Khanh N. Dang and Abderazek Ben Abdallah “An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems”, 2019 International Conference on Internet of Things, Embedded Systems and Communications (IINTEC), Dec. 20-22, 2019.
  7. Khanh N. Dang, Michael Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran, “2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults”, 2019 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Nov. 11-14, 2019.
  8. Khanh N. Dang, Akram Ben Ahmed, and Xuan-Tu Tran, ” An on-communication multiple-TSV defects detection and localization for real-time 3D-ICs”, 2019 IEEE 13th International Symposium on Embedded Multicore*Many-core Systems-on-Chip (MCSoC), Oct. 1-4, 2019.
  9. Khanh N. Dang, Akram Ben Ahmed, Ben Abdallah Abderrazak and Xuan-Tu Tran, “TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects”, The IEEE Symposium on VLSI (ISVLSI) 2019, Jul. 15-17, 2019.
  10. Khanh N. Dang and Xuan-Tu Tran, “Parity-based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication”, 2018 IEEE 12th International Symposium on Embedded Multicore*Many-core Systems-on-Chip (MCSoC), Sep. 12-14, 2018.
  11. Abderazek Ben Abdallah, Khanh N. Dang, Yuichi Okuyama, “A Low-overhead Fault tolerant Technique for TSV-based Interconnects in 3D-IC Systems”, The 18th International conference on Sciences and Techniques of Automatic control and computer engineering (STA), Dec. 21-23, 2017.
  12. Shunsuke Mie, Yuichi Okuyama, Yusuke Sato, Ye Chan, Nam Khanh Dang, Ben Abdellash Abderazek, “Real-Time UAV Attitude Heading Reference System Using Extended Kalman Filter for Programmable SoC”, 2017 IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC), Sep. 18-20, 2017.
  13. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, “Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D NoC System”, 25th IEEE Asian Test Symposium (ATS), Nov. 21-24, 2016,
  14. Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah, “Soft-Error Resilient Network-on-Chip for Safety-Critical Applications”, 2016 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT), Jun. 27 – 29, 2016.
  15. Khanh N. Dang, Michael Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, Xuan-Tu Tran, “Soft-Error Resilient 3D Network-on-Chip Router”, IEEE 7th International Conference on Awareness Science and Technology (iCAST), Sep. 22-24, 2015,
  16. Ngoc-Mai Nguyen, Edith Beigne, Suzanne Lesecq, Duy-Hieu Bui, Nam-Khanh Dang, Xuan-Tu Tran, “H.264/AVC Hardware Encoders and Low-Power Features”, 2014 IEEE Asia Pacific Conference on Circuits & Systems (APCCAS), Nov. 17-20, 2014.
  17. Nam-Khanh Dang, Xuan-Tu Tran, Alain Merigot, “An Efficient Hardware Architecture for Inter-Prediction in H.264/AVC Encoders”, 17th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS), Apr. 23-25, 2014.
  18. Hai-Phong Phan, Hung K. Nguyen, Duy-Hieu Bui, Nam-Khanh Dang, Xuan-Tu Tran, ” System-on-Chip Testbed for Validating the Hardware Design of H.264/AVC Encoder”, National Conference on Electronics and Communications (REV2013-KC01), Hanoi, Dec., 2013.
  19. Nam Khanh Dang, Van-Mien Nguyen, Xuan Tu Tran, “A VLSI Implementation for Inter-Prediction Module in H.264/AVC Encoders”, 2013 International Conference on Integrated Circuits and Devices in Vietnam (ICDV), 2013.
  20. Nam Khanh Dang, Thanh Vu Le Van, Xuan Tu Tran, “FPGA implementation of a low latency and high throughput network-on-chip router architecture”, 2011 International Conference on Integrated Circuits and Devices in Vietnam (ICDV), 2011.

Invited talks

  1. Khanh N. Dang,“Fault-Tolerance Through-Silicon-Via For 3-D Integrated Circuits”, Advanced Institute of Engineering and Technology, VNU-UET, VNU, Vietnam, 2021.
  2. Khanh N. Dang, “TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems”, The 3nd IEEE South-East Asia Workshop on Circuits and Systems (SEACAS), UPM, Malaysia, 2019. [SLIDE].
  3. Khanh N. Dang, “Toward Real-time Fault-tolerance Through-Silicon-Via based 3D Network-on-Chips”, The 2nd IEEE South-East Asia Workshop on Circuits and Systems (SEACAS), Bandung, Indonesia, 2018. [SLIDE].
  4. Khanh N. Dang, “Fault-Tolerant Architectures and Algorithms for 3D-Network-on-Chips”, The 1st IEEE South-East Asia Workshop on Circuits and Systems (SEACAS), Hanoi, Vietnam, 2017. [SLIDE].

Thesis

  1. Dang Nam Khanh, “Development of On-Chip Communication Fault-Resilient Adaptive Architectures and Algorithms for 3D-IC Technologies (3次元IC技術のための適応型耐障害チップ内通信アーキテクチャとアルゴリズムの開発)”, Research advisor: Prof. Abderazek Ben Abdallah. [DOI]/[PDF]/[SLIDE].